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KNDSYSTEM

   Applications+
KNDSYSTEM Applications [semiconductor]
semiconductor
Various PCB Sealing

When the PCB and components are soldered coating solution UNDERFILL (Epoxy) with the BGA around due to capillary action and the solution will penetrate. So if the solution is hardened by heat or UV reaction to prevent such CRACK and acts as a buffer to external shocks. Usually to a heat curing proceeds through only UV particular case? This section representation of gray you see in the picture If you think this is a solution containing UNDERFILL.